Semiconductor companies

Results: 1977



#Item
631Electronic engineering / Electrical engineering / Mechanical engineering / Microelectromechanical systems / Microtechnology / Transducers / Fairchild Semiconductor / Application-specific integrated circuit / Semiconductor Equipment and Materials International / Technology / Electromagnetism / Semiconductor companies

Methodical approach to MEMS development Name: D. Mladenovic Date: Sep. 9, 2014

Add to Reading List

Source URL: www.gsaglobal.org

Language: English - Date: 2014-09-26 14:37:54
632Xilinx / Field-programmable gate array / Altera / Transistor count / Complex programmable logic device / PowerPC / Application-specific integrated circuit / Actel / Microprocessor / Electronic engineering / Fabless semiconductor companies / Electronics

HC19AMTutorial.peter_alfke.print.v2.ppt

Add to Reading List

Source URL: www.hotchips.org

Language: English - Date: 2013-07-27 23:57:31
633Electronics / Computing / Ambric / Field-programmable gate array / Parallel computing / Application-specific integrated circuit / Xilinx / Mercury Computer Systems / Electronic engineering / Fabless semiconductor companies / Reconfigurable computing

HC19AMTutorial.shepard_siegel.v10.ppt

Add to Reading List

Source URL: www.hotchips.org

Language: English - Date: 2013-07-27 23:57:49
634Fabless semiconductor companies / Integrated circuits / IMEC / Leuven / Three-dimensional integrated circuit / Open-Silicon / Xilinx / TSMC / Amkor Technology / Semiconductor device fabrication / Electronic engineering / Electronics

3D-IC PACKAGING January 2015 3D-IC Leadership Team 

Add to Reading List

Source URL: www.gsaglobal.org

Language: English - Date: 2014-12-29 12:50:47
635Tires / Materials science / Electromagnetism / Microelectromechanical systems / Microtechnology / Transducers / Analog Devices / Tire pressure monitoring system / Microphone / Semiconductor companies / Technology / Automatic identification and data capture

Proactive MEMS IP Management GSA MEMS Working Group Meeting December 10, 2014

Add to Reading List

Source URL: www.gsaglobal.org

Language: English - Date: 2014-12-15 16:21:36
636Wireless / Fabless semiconductor companies / WirelessHD / SiBEAM / Microwave / IEEE 802.11 / Orthogonal frequency-division multiplexing / 1080p / Technology / Wireless networking / Telecommunications engineering

HC19A 4 Gbps Wireless True Uncompressed 1080p-Capable HD A-V Transceiver Using 60 GHz.ppt

Add to Reading List

Source URL: www.hotchips.org

Language: English - Date: 2013-07-28 00:00:42
637Computing / Wireless sensor network / Fabless semiconductor companies / Energy harvesting / Microtechnology / Sensor node / Silicon Laboratories / Universal Serial Bus / Solar cell / Technology / Wireless networking / Computer hardware

MCU SOLUTIONS Energy Harvesting Solutions www.silabs.com/energy-harvesting

Add to Reading List

Source URL: www.silabs.com

Language: English - Date: 2012-11-16 16:40:03
638Semiconductor companies / Sony / Cell / Toshiba / IBM / Silicon on insulator / Power Architecture / National Semiconductor / Technology / Electronics / Electronic engineering

April 2, 2002 IBM, Sony, SCE and Toshiba to Jointly Develop Chip-Making Process Technology Powerful alliance is formed for semiconductor processes TOKYO, JAPAN and EAST FISHKILL, N.Y., April 2, In a unique colla

Add to Reading List

Source URL: www.scei.co.jp

Language: English - Date: 2009-10-28 04:21:55
639Semiconductor sales leaders by year / Technology / Global Semiconductor Alliance / Economics / National Semiconductor / Fabless semiconductor companies / Private equity / Venture capital

Semiconductor Investment – Redefining the Funding Model Hosted by Ralph Schmitt President & Chief Executive Officer PLX Technology Moderator: Chad Keck

Add to Reading List

Source URL: www.gsaglobal.org

Language: English - Date: 2014-01-22 10:50:37
640Three-dimensional integrated circuit / Technology / Integrated circuits / Semiconductor device fabrication / Almanac

3D IC ALMANAC 3D IC Almanac Progress Update on 3D IC Roadmap Workgroup  Encountered resistance extracting data from companies regarding their 3D IC readiness and future roadmap.

Add to Reading List

Source URL: www.gsaglobal.org

Language: English - Date: 2014-01-22 10:41:21
UPDATE